LSRFSBKS2092 doc. no : qw0905- rev. : date : 16 - nov. b - 2005 data sheet LSRFSBKS2092 dual color led lamps ligitek electronics co.,ltd. property of ligitek only
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 30 -30 75% 25% 75% 100% 50% -60 25% 050% 100% 60 0 LSRFSBKS2092 package dimensions part no. ligitek electronics co.,ltd. property of ligitek only page 1/5 3.0 2.54typ 2.0min 0.5 typ 1.5 max 18.0min 1.anode blue 2.common cathode 3.anode red 2.54typ 2.0min 1 2 3 1 3 2 4.2 6.7 0.5 5.2 sbks 4.0 srf
i f forward current 30 ma 30 power dissipation peak forward current duty 1/10@10khz reverse current @5v storage temperature soldering temperature part no typical electrical & optical characteristics (ta=25 # ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. LSRFSBKS2092 operating temperature algainp ingan/sic material 65 90 120 160 luminous intensity @20ma(mcd) min. typ. 60 60 viewing angle 2 $ 1/2 (deg) -30 ~ +100 max 260 # for 5 sec max (2mm from body) -20 ~ +80 tsol tstg t opr pd ir i fp 75 90 ma mw % a # # 100 120 absolute maximum ratings at ta=25 # part no. ratings ligitek electronics co.,ltd. property of ligitek only parameter LSRFSBKS2092 symbol srf unit page sbk - s 2/5 500 v 2000 esd electrostatic discharge( * ) 10 50 white diffused 475 ---- 263.54.2 dominant wave length & dnm lens 630 color forward voltage @20ma(v) spectral halfwidth '& nm typ. min.max. 201.52.4 ---- emitted red blue static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. *
ambient temperature( ) fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -40 0.8 -2020 04060 0.9 1.0 1.2 1.1 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 0.0 80100-40-20 020 3.0 2.5 2.0 1.0 1.5 0.5 100 60 4080 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage srf chip f o r w a r d c u r r e n t ( m a ) forward voltage(v) 0.1 1.02.0 1.0 10 3.04.0 100 1000 forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 1.5 1.0 0.5 0.0 5.01.010 3.0 2.5 2.0 1001000 ligitek electronics co.,ltd. property of ligitek only fig.5 relative intensity vs. wavelength r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 600 550 0.0 0.5 650 1.0 700 part no. LSRFSBKS2092 3/5 page
25 ambient temperature( ) fig.3 forward current vs. temperature 0 f o r w a r d c u r r e n t @ 2 0 m a 0 10 20 40 30 680 630 530 430 480 480 0 380 580 r e l a t i v e i n t e n s i t y @ 2 0 m a 100 5075 wavelength (nm) fig.4 relative intensity vs. wavelength 0.5 1.0 2 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve f o r w a r d c u r r e n t ( m a ) 1 0 5 10 15 30 25 20 sbk-s chip 1.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward current(ma) 5 4 3 05 forward voltage(v) 0 0.25 0.75 0.5 30 25 15 1020 fig.2 relative intensity vs. forward current 1.5 1.25 part no. LSRFSBKS2092 ligitek electronics co.,ltd. property of ligitek only page4/5
mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. solder resistance test solderability test thermal shock test low temperature storage test high temperature high humidity test high temperature storage test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. the purpose of this test is the resistance of the device under tropical for hous. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-883:1008 jis c 7021: b-10 ligitek electronics co.,ltd. property of ligitek only LSRFSBKS2092 reliability test: test item part no. test condition description reference standard page 5/5
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